Well, the Lids serve a Purpose, they take the Heat Directly from the Die and Spread it to a Larger Surface Area for the Heat sink to absorb.


AMD Chips have always used a Solder Based TIM Between the Die and the Heat spreader, so heat transfers really well.

Also have to look at, before heat spreaders, when Dies were exposed on Athlon Chips, they had Rubber Feet to keep the heat sinks from rocking, and they didn't always work well.

Intel for a while had used some cheapo paste TIM between their Die and Head Spreader, which caused issues, so people started easily using razor blades to cut the glue and pull the heat spreader off, and mod heatsinks to directly make contact w/ the die.


HAF922, Corsair RM850, ASRock Fata1ity 990FX Pro,
Modified Corsair H100, AMD FX8350 @ 5.31GHz, 16GB G.SKILL@DDR2133,
2x R7970 Lightnings, +1 HD7950 @ 1.1/6.0GHz, Creative XFi Fata1ity Platinum Champ.,
3x ASUS VS248HP + Hanns�G HZ201HPB + Acer AL2002 (5760x1080+1600x900+1680x1050), Oculus Rift CV
CH Fighterstick, Pro Throt., Pro Pedals, TM Warthog & MFDs, Fanatec CSR Wheel/Shifter, Elite Pedals
Intensity Pro 10-Bit, TrackIR 4 Pro, WD Black 1.5TB, WD Black 640GB, Samsung 850 500GB, My Book 4TB